Product

Phone

086-769-81605596
Address

1106, Jinlong Bldg., Xiaobian, Chang'an Town, Dongguan, Guangdong, China (Mainland)
E-mail

k@waimaotong.com

LatestProducts

Top quality ENIG FR4 multilayer pcb factory in China

Top Quality Enig Fr4 Multilayer Pcb Factory In China , Find Complete Details about Top Quality Enig Fr4 Multilayer Pcb Factory In China,Pcb Factory,Fr4 Multilayer Pcb Factory,China Enig Fr4 Multilayer Pcb Factory from Multilayer PCB Supplier or Manufacturer-Shenzhen Hansion Technology Co., Ltd.

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Description

Overview

Quick Details

Place of Origin:: Guangdong, China (Mainland)

Brand Name:: HS

Model Number:: HS FR4 multilayer pcb factory

Number of Layers:: 4-Layer

Base Material:: FR4 Aluminum CEM-1 FPC

Copper Thickness:: 1-3oz

Board Thickness:: 0.1-2.0mm

Min. Hole Size:: 0.2mm

Min. Line Width:: 0.15mm

Min. Line Spacing:: 0.15mm

Surface Finishing:: HASL EING OSP

product name:: China ENIG FR4 multilayer pcb factory

Number of layer:: 1-12layer

Certification:: CE UL ROHS ISO9001

Warranty:: 2 years

Design service:: Available

Testing:: Function testing

Delivery:: DHL Fedex UPS EMS

Solder mask:: White Black Green Blue Red,etc.

Other service:: Components purchasing and assembly

PCB clone:: acceptable

Packaging & Delivery

Packaging Details: Inner vacuum packing,Outer carton box for best China ENIG FR4 multilayer pcb factory

Delivery Time: Shipped in 3 days after payment

Top quality ENIG FR4 multilayer pcb factory in China

We can do for you:

♦ 1—12 layer FR4 PCB,1 layer Aluminum PCB,1-4 layer Flexible PCB.

♦ 1—3oz copper thickness.

♦ 0.2mm hole size.

♦ 0.1mm track width/space.

♦ SMT PCBA service.

FAQ:

Q:1.Can i have a sample to test?

A:Yes,we can send you samples to test.

Q:2.What specifications do you need for PCB quotation?

A:We need your PCB Gerber file,board thickness,copper thickness,surface finishing and quantity to quote you.

Q:3.What is the lead time?

A:Samples need 3-5days,mass production needs 7-10days,also according to the order volume.

Q:4.Do you have MOQ limit?

A:Even 1 pcs,we care.

Q:5.Can you offer the best price for us?

A:Yes,we are specialized PCB manufacturer directly,we can offer lower price than any trading company.

Q:6.How do you ship the goods and how long does it take arrival?

A:We usually ship by DHL,UPS,FedEx and TNT.It takes 3-5days to arrive.

Q:7.What are the payment terms?

A:You can pay us with Paypal,Western Union and T/T Bank.

Q:8.Can we visit your factory?

A:Yes,welcome to visit our factory anytime,and we will lead you to visit our factory and our production line.

Manufacturing Capability:

item	Manufacture Capability
Material	FR4,CEM-1, Aluminium, Polyamide
Layer No.	1-12
Finished board thickness	0.1 mm-4.0mm
Board Thickness Tolerance	±10%
Cooper thickness	0.5 OZ-3OZ (18 um-385 um)
Copper Plating Hole	18-40 um
Impedance Control	±10%
Warp&Twist	0.70%
Peelable	0.012"(0.3mm)-0.02’(0.5mm)
Images
Min Trace Width (a)	0.075mm (3mil)
Min Space Width (b)	0.1mm (4 mil)
Min Annular Ring	0.1mm (4 mil)
SMD Pitch (a)	0.2 mm(8 mil)
BGA Pitch (b)	0.2 mm (8 mil)
Solder Mask
Min Solder Mask Dam (a)	0.0635 mm (2.5mil)
Solder mask Clearance (b)	0.1mm (4 mil)
Min SMT Pad spacing (c)	0.1mm (4 mil)
Solder Mask Thickness	0.0007"(0.018mm)
Holes
Min Hole size (CNC)	0.2 mm (8 mil)
Min Punch Hole Size	0.9 mm (35 mil)
Hole Size Tol (+/-)	PTH:±0.075mm;NPTH: ±0.05mm
Hole Position Tol	±0.075mm
Plating
HASL	2.5um
Lead free HASL	2.5um
Immersion Gold	Nickel 3-7um Au:1-5u''
OSP	0.2-0.5um
Outline
Panel Outline Tol (+/-)	CNC: ±0.125mm, Punching: ±0.15mm
Beveling	30°45°
Gold Finger angle	15° 30° 45° 60°
Certificate	ROHS, ISO9001:2008, SGS, UL certificate

item

Manufacture Capability

Material

FR4,CEM-1, Aluminium, Polyamide

Layer No.

1-12

Finished board thickness

0.1 mm-4.0mm

Board Thickness Tolerance

±10%

Cooper thickness

0.5 OZ-3OZ (18 um-385 um)

Copper Plating Hole

18-40 um

Impedance Control

±10%

Warp&Twist

0.70%

Peelable

0.012"(0.3mm)-0.02’(0.5mm)

Images

Min Trace Width (a)

0.075mm (3mil)

Min Space Width (b)

0.1mm (4 mil)

Min Annular Ring

0.1mm (4 mil)

SMD Pitch (a)

0.2 mm(8 mil)

BGA Pitch (b)

0.2 mm (8 mil)

Solder Mask

Min Solder Mask Dam (a)

0.0635 mm (2.5mil)

Solder mask Clearance (b)

0.1mm (4 mil)

Min SMT Pad spacing (c)

0.1mm (4 mil)

Solder Mask Thickness

0.0007"(0.018mm)

Holes

Min Hole size (CNC)

0.2 mm (8 mil)

Min Punch Hole Size

0.9 mm (35 mil)

Hole Size Tol (+/-)

PTH:±0.075mm;NPTH: ±0.05mm

Hole Position Tol

±0.075mm

Plating

HASL

2.5um

Lead free HASL

2.5um

Immersion Gold

Nickel 3-7um Au:1-5u''

OSP

0.2-0.5um

Outline

Panel Outline Tol (+/-)

CNC: ±0.125mm, Punching: ±0.15mm

Beveling

30°45°

Gold Finger angle

15° 30° 45° 60°

Certificate

ROHS, ISO9001:2008, SGS, UL certificate

Phone

Address

E-mail

Top quality ENIG FR4 multilayer pcb factory in China

Description

Top quality ENIG FR4 multilayer pcb factory in China

We can do for you:

♦ 1—12 layer FR4 PCB,1 layer Aluminum PCB,1-4 layer Flexible PCB.

♦ 1—3oz copper thickness.

♦ 0.2mm hole size.

♦ 0.1mm track width/space.

♦ SMT PCBA service.

FAQ:

Q:1.Can i have a sample to test?

A:Yes,we can send you samples to test.

Q:2.What specifications do you need for PCB quotation?

A:We need your PCB Gerber file,board thickness,copper thickness,surface finishing and quantity to quote you.

Q:3.What is the lead time?

Q:4.Do you have MOQ limit?

A:Even 1 pcs,we care.

Q:5.Can you offer the best price for us?

A:Yes,we are specialized PCB manufacturer directly,we can offer lower price than any trading company.

Q:6.How do you ship the goods and how long does it take arrival?

A:We usually ship by DHL,UPS,FedEx and TNT.It takes 3-5days to arrive.

Q:7.What are the payment terms?

A:You can pay us with Paypal,Western Union and T/T Bank.

Q:8.Can we visit your factory?

A:Yes,welcome to visit our factory anytime,and we will lead you to visit our factory and our production line.

item

Manufacture Capability

Material

FR4,CEM-1, Aluminium, Polyamide

Layer No.

1-12

Finished board thickness

0.1 mm-4.0mm

Board Thickness Tolerance

±10%

Cooper thickness

0.5 OZ-3OZ (18 um-385 um)

Copper Plating Hole

18-40 um

Impedance Control

±10%

Warp&Twist

0.70%

Peelable

0.012"(0.3mm)-0.02’(0.5mm)

Images

Min Trace Width (a)

0.075mm (3mil)

Min Space Width (b)

0.1mm (4 mil)

Min Annular Ring

0.1mm (4 mil)

SMD Pitch (a)

0.2 mm(8 mil)

BGA Pitch (b)

0.2 mm (8 mil)

Solder Mask

Min Solder Mask Dam (a)

0.0635 mm (2.5mil)

Solder mask Clearance (b)

0.1mm (4 mil)

Min SMT Pad spacing (c)

0.1mm (4 mil)

Solder Mask Thickness

0.0007"(0.018mm)

Holes

Min Hole size (CNC)

0.2 mm (8 mil)

Min Punch Hole Size

0.9 mm (35 mil)

±0.075mm

Plating

HASL

2.5um

Lead free HASL

2.5um

Immersion Gold